IOTA
Electronic Component Protection LED Lighting Automotive Electronics Industrial Equipment Aerospace ......
2025-02-02Key Performance Parameters Mixing Ratio: Commonly 1:1 or 10:1, ensuring uniform mixing for optimal performance. Working Time: Typically 30 minutes to several hours, adjustable ......
2025-02-02Flexibility and Resilience Forms an elastic gel after curing, capable of absorbing mechanical stress, thermal expansion, and shocks. Superior Temperature Resistance Operates sta......
2025-02-01is a high-performance silicone-based material consisting of two parts (A and B). Upon mixing, it undergoes a chemical reaction to form a soft, elastic gel. It offers excellent electrical insulation, ......
2025-02-01: Select suitable thermal performance based on heat management needs. : Ensure strong bonding with substrates. : Consider temperature, humidity, and mechanical vibrations. : Su......
2025-01-31: Thermal bonding for heat sinks, IC chips, CPUs, and MOSFETs. : Encapsulation of fixtures and drivers to enhance thermal efficiency and lifespan. : Heat management for battery packs,......
2025-01-31Key Performance Parameters : Typically ranges from 0.8 to 3.5 W/m·K, adjustable for specific needs. : -50°C to 200°C; high-performance variants can withstand up to 250°C. ......
2025-01-30Effectively reduces the operating temperature of components, extending their service life. Protects electronic components from short circuits or electrical shock. Ma......
2025-01-30is a bonding material made of silicone as the base and filled with thermally conductive fillers. It is primarily used for heat dissipation and bonding in electronic components. With excellent thermal......
2025-01-29Operating EnvironmentPerformance RequirementsApplication ProcessCost and Production Scale......
2025-01-29Automotive ElectronicsIndustrial EquipmentLED LightingConsumer Electronics......
2025-01-28Mechanical PropertiesElectrical PropertiesThermal PropertiesChemical PropertiesEnvironmental Properties......
2025-01-28Silicone Potting Compound Features: Commonly used for electronic devices in harsh environments, such as LED modules and solar equipment. Drawbacks......
2025-01-27Polyurethane Potting Compound Features: Suitable for applications requiring flexible protection, such as automotive electronics, circuit boards, and LED drivers. Drawbacks......
2025-01-27Epoxy Potting Compound Features: Ideal for scenarios requiring long-term fixation and high mechanical strength, such as transformers, inductors, and sensors. Drawbacks......
2025-01-26
