The loss of power in the operation of electronic devices is mainly converted into thermal energy, which causes the temperature of electronic equipment to rise and thermal stress increases, seriously affecting the reliability and service life of electronic devices, so the need for these residual heat energy as soon as possible to dissipate. In this heat dissipation process, thermal interface materials play a crucial role. Thermal interface materials are mainly used to fill the electronic devices and heat sink contact micro-gaps and surface unevenness of the holes, reducing the thermal resistance of heat transfer.
In recent years, with the rapid development of electronic technology, the characteristic size of electronic devices has been drastically reduced from the micron scale to the nanometer scale, while the integration degree is increasing at a high rate of 40%~50% per year. With the arrival of the 5G era characterized by high frequency and high speed and the maturity of 5G technology, various types of wireless mobile terminal devices such as smart wear, driverless cars, VR/AR, etc. are being vigorously developed, and there is an upgrading of hardware components. Compared with 4G wireless mobile terminal equipment, the chip processing capacity of 5G wireless mobile terminal equipment has been greatly increased to 4~5 times that of 4G, thus power consumption is greatly increased, and the heat generated is also significantly increased; the number of antennas of 5G wireless mobile terminals has also reached 5~10 times that of 4G wireless mobile terminals; 5G wireless mobile terminals also adopt new materials such as ceramics and glass shells, which do not have a shielding effect on the 5G signals, but these materials do not have a shielding effect on the 5G signals. and other new materials, but the heat dissipation performance of these materials is weaker than that of metals, so materials with better thermal conductivity are needed. At the same time, the construction of 5G communication base stations also requires a large number of thermal interface materials for rapid heat dissipation. Therefore, on the one hand, the latest development of electronic technology has opened up a new field of application for thermal interface materials, making the role of thermal interface materials more and more important in all kinds of electronic products, and becoming an important material in the electronic heat dissipation engineering, and the use of which will continue to increase significantly in the future; on the other hand, the continuous updating and upgrading of electronic products has put forward a new set of performance requirements and technological challenges for the thermal interface materials related to the industrial chain.
At present, the common thermal interface materials on the market include thermally conductive silicone gel, thermally conductive spacer, thermally conductive silicone grease, thermally conductive adhesive, thermally conductive adhesive tape, phase change material, soldering material, and carbon-based thermally conductive interface material, and so on.