Silicone gel vulcanization for the solid-liquid coexistence of the state, the crosslink density is low (for the addition of molding silicone rubber 1/10 ~ 1/5), so that the production of thermally conductive silicone gel is prone to oil seepage problems, thereby contaminating the electronic devices, reducing the reliability of their long-time work, therefore, in the enhancement of the thermal conductivity of the silicone resin at the same time, you need to avoid the generation of oil seepage. Thermally conductive silicone gel crosslinking density, the greater the amount of oil seepage is smaller. This is because the crosslinking density of the thermal conductivity of the silicone gel system, more silicone macromolecules react with each other and crosslinked into a complete network structure system, mobility, uncrosslinked resin basically does not exist, even if there is a trace of the existence of a complete network structure system in the unit volume of the formation of a dense crosslinking points, the uncrosslinked resin in the movement of the network structure and the production of a larger coefficient of friction, hindering the flow of uncrosslinked resin, thus reducing the oil seepage. As a result, the uncrosslinked resin has a large friction coefficient with the network structure, which hinders the flow of the uncrosslinked resin and therefore reduces the amount of oil penetration.