Thermally conductive silica gel is widely used in various fields as a special thermal interface material, but at present, the high-end market of domestic thermally conductive silica gel is basically occupied by foreign thermal interface material companies, and the technology of domestic thermally conductive silica gel is uneven. At present, the thermally conductive silicone gel is limited to the blending compound of silicone matrix and common thermal conductive powder, and the comprehensive performance of the resulting thermally conductive silicone gel is not good enough to be applied in high-end fields. Therefore, it is necessary to improve the comprehensive performance of thermally conductive silica gel from the body of silicone resin, thermally conductive powder and the body and thermally conductive powder composite and other aspects, such as the type of silicone matrix, molecular weight and its distribution, viscosity, ratio and other aspects of the matrix design, the introduction of functional side chains and other ways of modification of the matrix, with the help of the dendritic or large ring structure of the hydroxy silicone to optimize the degree of cross-linking of the matrix, the thermally conductive Surface functionalization of the filler, hybridization of the filler in the composite of matrix and thermally conductive filler, etc., all of which will become a new direction in the study of thermally conductive silica gels.
With the arrival of the high-frequency, high-speed 5G era, the improvement of the integration degree of electronic devices, the increase in the number of networked devices and the growth of the number of antennas, the power consumption of the devices is increasing, and the heat generation is also rising rapidly. The new thermally conductive silica gel with excellent comprehensive performance is also bound to become one of the indispensable materials in strategic emerging fields and widely used in various fields.