The power loss during the operation of electronic devices is mainly converted into thermal energy, resulting in an increase in temperature and thermal stress of the electronic equipment, which seriously affects the reliability and service life of the electronic devices. Therefore, it is necessary to dissipate these excess thermal energy as soon as possible. In this heat dissipation process, the thermal interface material plays a crucial role. Thermal interface materials are mainly used to fill the micro gaps and uneven surface holes generated when electronic devices come into contact with heat sinks, reducing the thermal resistance of heat transfer.
In recent years, with the rapid development of electronic technology, the feature size of electronic devices has sharply decreased, moving from the micrometer level to the nanometer level, while the integration degree is increasing at a high rate of 40% to 50% annually. With the arrival of the 5G era characterized by high frequency and high speed, and the increasing maturity of 5G technology, various wireless mobile terminal devices such as smart wearables, autonomous vehicles, VR/AR are being vigorously developed, and hardware component upgrades are emerging. Compared to 4G wireless mobile terminal devices, the chip processing capability of 5G wireless mobile terminal devices has significantly increased to 4-5 times that of 4G, resulting in a significant increase in power consumption and heat generation; The number of antennas for 5G wireless mobile terminals has also reached 5-10 times that of 4G wireless mobile terminals.