Thermal conductive potting adhesive (HCY) is a low viscosity flame-retardant two-component addition molded organic silicon thermal conductive potting adhesive that can be cured at room temperature or by heating, with the characteristic of faster curing at higher temperatures. It is made by adding thermal conductivity to ordinary silicone or adhesive silicone, and is generally produced by excellent manufacturers. It does not produce any by-products during the curing reaction and can be applied to materials such as PC (Poly carbonate), PP, ABS, PVC, and metal surfaces. Suitable for thermal conductivity, insulation, waterproofing, and flame retardancy of electronic components, with flame retardancy reaching UL94-V0 level. To comply with the EU ROHS directive requirements. The main application areas are the encapsulation of electronic and electrical components, as well as electrical components. It is also used in situations such as temperature sensor encapsulation.