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Key Performance Parameters of Silicone Thermal Conductive Adhesive
Key Performance Parameters of Silicone Thermal Conductive Adhesive
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Key Performance Parameters
Thermal Conductivity: Typically ranges from 0.8 to 3.5 W/m·K, adjustable for specific needs.
Operating Temperature Range: -50°C to 200°C; high-performance variants can withstand up to 250°C.
Hardness: Shore A hardness typically ranges from 30 to 80, adjustable for various scenarios.
Adhesion Strength: Strong bonding to metals, plastics, ceramics, and other materials.
Curing Methods: Room temperature or heat curing, efficient and fast.
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