Convenient Curing Process
The A and B components cure rapidly after mixing, either at room temperature or under heat.

Flexibility and Resilience
Forms an elastic gel after curing, capable of absorbing mechanical stress, thermal expansion, and shocks.

Excellent Electrical Properties
High dielectric strength and volume resistivity for protecting high-voltage or sensitive electronic devices.

Superior Temperature Resistance
Operates stably within a range of -50°C to 200°C, with special formulations tolerating higher temperatures.

Eco-Friendly and Safe
Low volatility and non-toxic, ensuring no contamination of the environment or equipment.

Versatile Substrate Compatibility
Suitable for potting and protecting metals, ceramics, glass, and plastics.