Silicone thermal conductive gel is a high-performance thermal interface material primarily used in electronic devices, LED lighting, and automotive electronics to address heat dissipation issues during operation. It is based on silicone polymers, such as polydimethylsiloxane (PDMS), which offer excellent flexibility, temperature resistance, and chemical stability. To enhance thermal conductivity, fillers with high thermal conductivity, such as aluminum oxide, boron nitride, or aluminum nitride, are typically added. These fillers effectively transfer heat while maintaining the gel's softness and compressibility, ensuring close contact between heat sources and heat sinks. Additionally, crosslinking agents and catalysts are used to promote the crosslinking reaction of silicone polymers, forming a stable three-dimensional network structure that enhances the gel's mechanical strength and durability. Silicone thermal conductive gel also exhibits excellent electrical insulation and aging resistance, enabling long-term stability in complex environments. Its ease of application and ability to fill irregular surfaces make it an indispensable material for thermal management in modern electronic devices.