Addition-cure silicone gel is a high-performance silicone material that cures through an addition reaction, characterized by its unique chemical structure and excellent physical properties. The curing process is achieved via a hydrosilylation reaction, where a hydrogen-containing silicone oil reacts with a vinyl-containing silicone oil in the presence of a catalyst, forming a three-dimensional network structure. This reaction does not produce by-products, thus avoiding the formation of bubbles or shrinkage, ensuring high purity and stability of the material. Addition-cure silicone gel exhibits outstanding high-temperature resistance, maintaining stable physical and chemical properties across a wide temperature range from -50°C to 250°C. It also possesses excellent weather resistance, electrical insulation, and flexibility. Its low modulus and high elasticity enable it to effectively absorb stress, protecting sensitive components from mechanical shock and vibration. Additionally, addition-cure silicone gel has good biocompatibility and non-toxic properties, meeting medical and food-grade standards, making it widely used in medical devices and implants. In the electronics industry, it is commonly used for encapsulating, sealing, and protecting electronic components, effectively preventing damage from moisture, dust, and chemical substances, thereby extending the lifespan of devices. The ease of processing and customizability of addition-cure silicone gel allow it to meet the needs of various applications, such as filling complex shapes, coating, and compression molding. In summary, with its exceptional comprehensive performance and broad application fields, addition-cure silicone gel has become an indispensable key material in modern industry and high-tech development.