Home    Company News    The problem of heat dissipation in multiple fields was solved, and IOTA DZ125 single component pre cured thermal conductive silicon gel became the new favorite of the industry

The problem of heat dissipation in multiple fields was solved, and IOTA DZ125 single component pre cured thermal conductive silicon gel became the new favorite of the industry

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    With the rapid development of electronic equipment industries such as automotive electronics, communication, and network terminals, the issue of device heat dissipation has become increasingly prominent and has become a key factor affecting product performance and service life. In this context, IOTA DZ125 single component pre cured thermal conductive silicon gel, with its all-round excellent performance, stands out from many heat dissipation materials, becomes the ideal choice for various industries to solve heat dissipation problems, and quickly becomes the new favorite in the market.

    In the field of automotive electronic devices, high temperature environments and complex working conditions impose strict requirements on heat dissipation materials. IOTA DZ125 single component pre cured thermal conductive silicon gel has the characteristics of high thermal conductivity and low thermal resistance, which can efficiently cope with the large amount of heat generated by the vehicle electronic equipment during operation, and ensure the stable operation of various electronic components such as the vehicle navigation, vehicle entertainment system, and on-board computer. Its soft and stress free characteristics can effectively buffer the impact of vibration and shock on electronic components during vehicle operation, avoiding component damage caused by stress concentration, greatly improving the reliability and durability of automotive electronic devices.

    As the core hub of information transmission, communication equipment and network terminal devices require 24-hour uninterrupted operation, and heat dissipation performance is crucial. IOTA DZ125 can tightly adhere to the internal chips, modules, and other heating components of the device, dissipating heat through efficient heat conduction to ensure that the device always maintains good operating conditions and reduces network interruptions, communication failures, and other issues caused by overheating. The product has the characteristics of no settlement and no flow, and can fill complex gaps inside the equipment. No matter how precise the equipment structure is, it can achieve comprehensive coverage of heat dissipation protection, providing solid guarantee for smooth communication and network.

    For electronic and electrical devices and modules, the emergence of IOTA DZ125 has also brought significant improvements in heat dissipation. Its single component characteristic of not requiring mixing and curing simplifies the production process of electronic and electrical products and improves assembly efficiency. The advantage of being able to rework during the product repair process makes the repair work more convenient and reduces maintenance costs. The medium thickness design is suitable for the heat dissipation space of various electronic and electrical devices, without affecting the compactness of the equipment due to excessive thickness, nor causing poor heat dissipation effect due to excessive thickness.

    In terms of operational convenience, the fully cured feature of IOTA DZ125 eliminates long curing waiting times. Coupled with automated glue dispensing equipment for gas supply, it can achieve fast and accurate glue dispensing operations, greatly improving production efficiency. This is undoubtedly a powerful weapon for large-scale electronic manufacturing enterprises to increase production capacity and reduce production costs.

    In terms of safety, IOTA DZ125 does not contain toxins and corrosive substances, and meets the requirements of general industrial hygiene regulations, providing reliable protection for the health of operators. During transportation and storage, following non hazardous material transportation standards and taking basic protective measures such as keeping away from sources of fire and keeping containers sealed can ensure safety and reduce risks in logistics and storage.

    On the packaging side, IOTA DZ125 provides regular packaging of 300mL per unit, while also supporting customized packaging according to customer needs, flexibly meeting the procurement and usage needs of different enterprises.

    With its outstanding performance in many fields, IOTA DZ125 single component pre cured thermal conductive silicon gel is gradually becoming the preferred material in the field of electronic equipment heat dissipation, providing strong heat dissipation support for technology upgrading and product quality improvement in various industries, and leading the development of new trends in electronic heat dissipation materials.

    To learn more, please click IOTA DZ125

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