IOTA GNJ 3200PC is a two-component addition-curing silicone thermal conductive gel, engineered for heat dissipation of power batteries, electronic devices, and other heat-generating components. With a thermal conductivity of 2W·m⁻¹·K⁻¹ and soft compressible properties, it builds a dual barrier of efficient heat transfer and reliable protection. Post-curing, it forms a low-modulus elastomer (Shore 00 hardness 40±5) with excellent electrical insulation (volume resistivity >10¹⁴Ω·cm, breakdown voltage >25kV/mm) and UL94 V-0 flame retardancy, minimizing thermal runaway risks and ensuring component safety.

Key strengths include versatile curing (room temperature/25℃/24h or heat/80℃/1h), adapting to automated lines and manual operation; thixotropic formula preventing horizontal/vertical flow after application, solving traditional material overflow issues, with controllable thickness (0.2-5mm) for varied gap-filling needs; <0.5% shrinkage avoiding stress damage, and easy reworkability with no residue, reducing maintenance costs.

Applications span new energy vehicle power battery PACKs (cell-to-case gap filling for uniform temperature), consumer electronics (CPU/GPU thermal interface), LED power modules, and industrial control power devices. Its "soft compressible + high thermal conductivity" design enables tight to uneven surfaces, eliminating air gaps with thermal resistance as low as 0.15℃·in²/W. With -60~200℃ temperature resistance and >90% performance retention after 1000 thermal cycles (-40℃~125℃), it ensures long-term stability.

Mixing ratio 1:1 (A:B by weight), packaged as 20kg sets (10kg A + 10kg B), 12-month shelf life at room temperature. Addition-curing with no low-molecular by-products, RoHS/REACH compliant, meeting strict electronics standards.

IOTA GNJ 3200PC integrates "high thermal conductivity + flame retardancy + easy application" to become the ideal thermal material for power batteries and electronics, enhancing heat dissipation efficiency, extending product lifespan, and supporting new energy and smart hardware innovation.