Core Value
IOTA GNJ 3200PC addition-cured silicone thermal gel features "2W/m·K thermal conductivity + vertical non-flowing property", providing reliable heat dissipation for power batteries, electronic devices and other heat-generating components. The two-component design balances processibility and performance stability, making it ideal for thermal management of high-power equipment.

Product Features: Dual Protection of Safety and Heat Dissipation

• Efficient Thermal Conductivity & Insulation: 2W·m⁻¹·K⁻¹ thermal conductivity for rapid heat transfer; volume resistivity ＞10¹⁴Ω·cm and dielectric strength ＞20kV/mm ensure insulation safety of electronic components.
• Flexible Application: Medium-viscosity fluid, non-flowing in horizontal/vertical directions after application, suitable for filling complex structural gaps; room temperature curing (24h full cure) or heat-accelerated curing (80℃/2h) compatible with automated lines and manual operation.
• Reliable Physical Properties: Shore 00 hardness 30-40 after curing, soft and compressible for tight贴合 to uneven surfaces; shrinkage ＜0.5% without stress damage risk; UL94 V-0 flame retardancy for enhanced device safety.
• Easy Rework & Maintenance: Curable material can be easily peeled off for component repair or replacement, reducing production and after-sales costs.

Typical Applications

• Power Batteries: Filling between cells and heat sinks with thermal resistance as low as 0.8℃·in²/W, controlling battery pack temperature difference within ±3℃ and extending cycle life by 15%.
• Consumer Electronics: CPU/GPU chip cooling reduces core temperature by 8-10℃ compared to traditional silicone under 10W/cm² heat flux, ensuring long-term stable operation.
• Industrial Equipment: Potting for inverters and power modules with ＜5% thermal performance degradation in -40℃~200℃ range, meeting extreme environment requirements.

Quality Commitment
RoHS 2.0 and REACH certified, available in 50ml/300ml/20kg packaging with customizable viscosity and curing speed. Choose IOTA GNJ 3200PC to build a stable heat dissipation barrier for electronic devices with "high efficiency + safety".