Core Value
IOTA GNJ 3200PC two-component addition-cure silicone thermal gel cures into a soft, compressible material, designed to provide efficient heat dissipation for power batteries, electronic devices, and other heat-generating components. With a thermal conductivity of 2W·m⁻¹·K⁻¹ as its core, it features non-flowing application, low shrinkage, and easy rework, adapting to vertical/horizontal heat dissipation scenarios—an ideal choice balancing heat dissipation efficiency and process flexibility.
Product Features: Dual Advantages of Thermal Performance and Application Adaptability
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High Thermal Conductivity, Insulation Safety:Thermal conductivity of 2W·m⁻¹·K⁻¹ for rapid heat transfer; volume resistivity >10¹⁴Ω·cm, dielectric strength >20kV/mm, UL94 V-0 flame retardant rating, ensuring electronic device safety.
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Non-Flowing Application, Wide Scene Adaptation:No during horizontal/vertical application, precisely filling gaps between power battery cells and contact surfaces between electronic components and heat sinks, avoiding uneven heat dissipation caused by traditional thermal materials.
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Flexible Curing, Process Compatibility:Supports room temperature curing (24h full cure) or heat-accelerated curing (80℃/2h), compatible with automated dispensing and manual operation; cure shrinkage <0.5%, avoiding structural stress on precision components.
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Soft & Compressible, Easy Rework:Shore 00 hardness 20-30, soft to absorb vibration impact; peelable after curing, solving difficulties in disassembly and component damage with traditional thermal adhesives, reducing maintenance costs.
Typical Applications
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Power Battery Field:Filling gaps between battery cells, reducing module temperature difference by 8℃ after 1000 thermal cycles (100℃), increasing battery cycle life by 15%, meeting high heat dissipation requirements of new energy vehicles.
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Consumer Electronics:Potting 5G base station power modules, reducing surface temperature by 12℃ after 500 hours of continuous operation at 45℃, improving signal transmission stability by 10%.
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Industrial Equipment:Heat dissipation for high-power LED drivers, with thermal resistance as low as 0.25℃·in²/W at 0.5mm thickness, extending lamp life by 20%, adapting to high-temperature and high-humidity industrial environments.
Quality Assurance
RoHS 2.0 and UL certified, available in 50ml/200ml/5L packaging. Choose IOTA GNJ 3200PC to build a reliable heat dissipation barrier for heat-generating components with "high thermal conductivity + flexible application".
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