Key Benefits
✅ Instant Application

• Pre-cured one-part system eliminates mixing/curing steps
• 0.1~1mm thickness adapts to various assembly gaps
• Non-sagging for vertical applications (±0.1mm)

✅ Advanced Thermal Performance

• High thermal conductivity (verify value) with low interface resistance
• Fills surface irregularities up to 50μm Ra
• Long-term stability with zero pump-out

✅ Design Flexibility

• >0.5N/cm² tack strength for immediate fixation
• >30% compressibility relieves assembly stress
• Reworkable without residue or damage

Applications

• Automotive: Domain controller/LiDAR cooling
• 5G Infrastructure: PA module thermal interface
• Industrial: Servo drive IGBT dissipation

Upgrade to hassle-free thermal management! Free samples available.