In the production process of electronic and electrical products, traditional potting materials often require pre - treatment such as primer coating on substrates like PCB circuit boards, glass and aluminum, which not only prolongs the production cycle but also increases process costs. As a primer - less adhesion type two - component addition - type silicone sealant, IOTA GNJ 3126L specifically solves such pain points and provides an efficient and reliable adaptation solution for electronic potting scenarios.

IOTA GNJ 3126L is a two - component addition - type silicone that adopts a fast heating curing process. It does not need to wait for a long time for natural curing, which can greatly shorten the operation cycle of the production line and adapt to the fast - paced demand of mass production. It has excellent adhesion performance and can directly achieve primer - less adhesion on common substrates such as PCB circuit boards, glass and aluminum, eliminating the tedious step of primer pre - treatment, which not only reduces material consumption, but also avoids the risk of impurity residue that may be brought by the primer process.

This product has excellent low - temperature resistance, good high - temperature aging resistance. After curing, it always maintains rubber elasticity in a very wide temperature range, which can buffer the deformation stress caused by the thermal expansion and contraction of components and prevent precision electronic components from being damaged by external extrusion. Meanwhile, it has excellent insulation performance, and can always maintain a stable insulation protection state even under working conditions with frequent alternating high and low temperatures. No by - products are generated during the curing process, it contains no solvents, enabling deep curing. There is no volume shrinkage during curing, so no additional extrusion stress will be generated on the components.

It has good waterproof, moisture - proof and anti - aging properties, which can build a long - term and stable protective barrier for the circuit boards and components inside electronic and electrical products. It can realize reliable adhesion and potting without additional auxiliary processes, and is a practical protective material for cost reduction and efficiency improvement in the field of electronic and electrical manufacturing.