In the field of electronic and electrical appliances, thermal conductive silicon gel is also widely used. For example, in the heat dissipation of an integrated circuit (chip), the thermal conductive silicon gel is located in the middle of the processor and the heat sink, so that the heat emitted by the processor can be transferred to the heat sink more quickly, so that it can be dissipated to avoid excessive heat damage to the circuit. In addition, thermal conductive silicon gel is also widely used in communication equipment, mobile phone CPU, memory module, IGBT and other power modules, power semiconductor and other fields, providing a strong guarantee for the stable operation of these devices. It is worth mentioning that in the field of new energy vehicles, thermal conductive silicon gel also plays an indispensable role. In the face of vibration, temperature changes, rain soaking and other situations that may be encountered in electric vehicles, as well as extreme situations such as local short circuit and overload during battery failure or traffic accidents, the waterproof sealing, flame retardant sealing, heat dissipation and shock absorption fixed functions of thermal conductive silicon gel can greatly improve the safety performance of the power battery pack and protect the safety of the drivers and passengers in the electric vehicle. In addition, thermal conductive silicon gels also show great application potential in the field of 5G electronic equipment ‌.


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