5G wireless mobile terminals also use new materials such as ceramics and glass shells that do not shield 5G signals, but these materials have weaker heat dissipation performance than metals, so they require materials with better thermal conductivity. At the same time, the construction of 5G communication base stations also requires a large amount of thermal interface materials to provide rapid heat dissipation. On the one hand, the latest developments in electronic technology have opened up new application areas for thermal interface materials, making their role increasingly important in various electronic products and becoming an important material in electronic heat dissipation engineering. In the future, their usage will continue to increase significantly; On the other hand, the continuous updating and upgrading of electronic products have put forward new performance requirements and technological challenges for thermal interface materials related to the industrial chain.
At present, the common thermal interface materials in the market include thermal conductive silicon gel, thermal conductive gasket, thermal conductive silicone grease, thermal conductive adhesive, thermal conductive tape, phase change materials, welding materials and carbon based thermal conductive interface materials.