• Performance characteristics: Phenyl silicon gel is usually a gel like substance with phenylsiloxane as the main component, which has the excellent characteristics of organic silicon materials, such as good high and low temperature resistance, electrical insulation performance, etc. The presence of its phenyl group can also improve the material's oxidation resistance, thermal stability, shear resistance, and optical transparency.

• Role in moisture-proof of electronic components: electronic components are vulnerable to moisture and their performance will decline or even be damaged. Phenyl silicon gel IOTA 3128 has good waterproof and sealing properties. It can form a dense protective film on the surface of electronic components to prevent moisture intrusion, thus extending the service life of electronic components and ensuring their stable operation in humid environments.

•The advantages of being used as a material for transistors and integrated circuits are that transistors and integrated circuits generate heat during operation and require high electrical insulation and environmental stability. Phenyl silicon gel IOTA 3128 has excellent electrical insulation and thermal conductivity, which can effectively isolate different electrodes, prevent short circuit, quickly emit heat, resist external dust, water vapor and other pollutants, and provide a stable working environment for transistors and integrated circuits.

•Reason for elastic bonding of optical instruments: Optical instruments have strict requirements for adhesives, which need to have good optical transparency to avoid affecting optical performance, and also have a certain degree of elasticity to adapt to small deformations in different environments. Phenyl silicon gel IOTA 3128 has high optical transparency, which can meet the light transmission requirements of optical instruments. Its elastic properties can keep the bonding part in a good bonding state when affected by vibration, temperature changes and other factors, and will not damage the optical elements or cause the bonding part to crack due to stress concentration.

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