Recently, a high temperature resistant silicon gel named IOTA 6250H has come to the fore in the field of materials, which has attracted wide attention in the electronics industry. This product was developed and launched by IOTA, demonstrating excellent performance in applications such as electronic component encapsulation, and is expected to reshape the material selection pattern in related industries.
IOTA 6250H is a medium viscosity, transparent two-component silicone gel. Its curing mode is flexible, which can be cured naturally at room temperature or accelerated at high temperature. This unique product feature makes it highly applicable in the manufacturing of numerous electronic devices. It is widely used in the encapsulation of IGBT modules and electronic components of optoelectronic devices, and is also an ideal packaging material for automotive electronic precision electrical circuits and hybrid circuit modules. In the fields of solar cells, sensors, high-power rectifiers, and rectifier bridge modules, IOTA 6250H also performs well, reliably protecting sensitive microelectronic components from moisture and corrosion.
Compared with ordinary silicon gel, IOTA 6250H has more excellent high temperature resistance performance, which makes it irreplaceable in electronic equipment working under high temperature environment. In addition, this product also has many advantages such as low hardness, small shrinkage rate, no corrosion, no low molecular weight silicone oil precipitation, and stable chemical properties, providing a solid guarantee for the long-term stable operation of electronic devices.
In terms of operation, the usage of IOTA 6250H is relatively simple. Before use, simply mix components A and B in a 1:1 ratio and stir for about 5 minutes. Then, it is recommended to defoam in a vacuum environment of -0.09MPa~-0.08MPa for 5-10 minutes before putting them into use. The curing speed is closely related to temperature, and at room temperature of 25 β, it begins to thicken after about 2.5 hours; If the temperature is raised to 120 β, full curing can be achieved in just 30 minutes. It should be noted that the mixed adhesive should be stored in a sealed manner and used up as soon as possible within the safe operating period to avoid waste caused by slow curing.
It is worth mentioning that although IOTA 6250H has excellent performance, it is also unambiguous in terms of security. This product is non hazardous, but it should still be avoided from entering the mouth and coming into contact with the eyes during use. If accidentally splashed, rinse immediately with plenty of water. In addition, both components A and B of the colloid need to be strictly sealed and stored to prevent leakage during transportation. At the same time, the product cannot come into contact with compounds containing N, P, S ions, as well as materials such as amines, polyurethanes, amides, azides, organotin compounds, etc., in order to avoid poisoning the platinum catalyst and affecting the curing effect of the product.
At present, IOTA 6250H offers two packaging specifications: A/B component 20KG and A/B component 180KG, which are convenient for enterprises of different sizes to choose from. In terms of storage, the product needs to be stored in a dry place for a period of 12 months. After expiration, it needs to be retested. If it passes the test, it can still be used. Moreover, as the product belongs to non hazardous materials, it can be transported according to the standards of general chemicals, greatly reducing logistics costs and safety risks.
With the development of electronic devices towards miniaturization and high performance, the performance requirements for electronic encapsulation materials are becoming increasingly stringent. The emergence of IOTA 6250H high temperature resistant silicon gel undoubtedly brings new solutions to the electronic industry and is expected to promote new breakthroughs in stability, reliability and high temperature resistance of electronic equipment in the future.
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IOTA 6250H
