Recently, a two-component 1:1 addition molding silicone gel named IOTA 6450 has attracted attention in the electronic component encapsulation market, and has become the new favorite of many enterprises in the electronic industry with its excellent performance.

    IOTA 6450 has many outstanding features. It adopts a two-component 1:1 mixing design, which is easy to operate, and the addition molding curing process produces no by-products, ensuring the purity of electronic components. Its low viscosity characteristics enable the adhesive to quickly fill the fine gaps of electronic components, while also curing quickly, greatly shortening the production cycle. The product is transparent, soft, and self-healing, with high light transmittance and minimal yellowing, perfectly meeting the high optical performance and appearance requirements of electronic components such as IGBT, LED lampshades, and automotive electronics for encapsulation.

    In practical operation, it is only necessary to clean the surface of the device with an appropriate solvent to remove oil before use. The A and B components should be thoroughly mixed in a 1:1 ratio and defoamed under vacuum at -0.09MPa~-0.08MPa for 5-10 minutes before use. The curing conditions are flexible and diverse, and various curing schemes such as 24 hours at 25 ℃ and 1 hour at 65 ℃ can be selected according to different devices and production needs. In addition, the cured gel can be easily removed, repaired or modified. After repair, it is perfectly integrated with raw materials, which facilitates the maintenance and upgrading of electronic components.

    IOTA 6450 offers two packaging specifications of 20KG and 180KG to meet the production needs of enterprises of different scales. The product should be stored in a dry place below 35 ° C for a period of 12 months. After expiration and passing re inspection, it can still be used and is considered a non hazardous material, which can be transported as a general chemical.

    With the rapid development of the electronics industry, the requirements for electronic component encapsulation materials are becoming increasingly stringent. The emergence of IOTA 6450 organosilicon gel has brought new solutions to the industry, which is expected to promote the encapsulation technology of electronic components to a new level.

    To learn more, please click IOTA 6450