IOTA
IOTA 6450 is a two-component, 1:1 addition silicone gel, which can be cured at room temperature or by heating. Mainly used for sealing electronic components such as IGBT, LDE lampshades, and automotive electronics.
Product features
1. Two component, 1:1 mixture
2. Addition curing without by-products
3. Low viscosity, fast curing
4. Transparent and soft, with self-healing properties
5. High transmittance, yellow becomes smaller
Product parameters
|
Inspection items |
Component |
Test Method |
Results |
|
Before curing
|
|||
|
Viscosity（mpa.s) |
A |
GB/T 2794 |
260 |
|
B |
GB/T 2794 |
500 |
|
|
Mixing ratio |
A:B |
/ |
1:1 |
|
Mixed viscosity(mpa.s) |
A+B |
B/T 2794 |
360 |
|
Mixed density(g/cm3) |
A+B |
GB/T 13354 |
0.97 |
|
Operating time after mixing/25℃(min) |
A/B |
GB/T 7123 |
40 |
|
Gel time/25℃(h) |
A+B |
/ |
6 |
|
Curing conditions(℃×min) |
A+B |
/ |
120×30 |
|
After curing
|
|||
|
Density/25℃(g/cm3) |
GB/T 13354 |
0.98 |
|
|
Penetration(mm*10-1) |
|
GBT 4509-2010 |
250~400 |
|
Dielectric constant |
|
GB/T1693 |
2.7 |
|
Volume resistivity(Ω·cm) |
|
GB/T 1692 |
1015 |
|
Dielectric strength（KV/mm） |
|
GB/T 1695 |
15 |
|
Refractive index/23℃ |
|
ABBE |
1.405 |
|
Transmittance(％) |
|
UV-VIS |
99 |
The data in the table is for reference only, please refer to the measured data
Operation and Safety
1. Before using silicone gel, clean and degrease the surface of the device with an appropriate solvent. Mix the two components in a weight or volume ratio of 1:1. Be careful not to mix air during operation. It is recommended to degas for 5-10 minutes under a vacuum of -0.09MPa~-0.08MPa before use. The glue mixed with components A and B for 3 minutes should be sealed and stored, and used up within 10 minutes, otherwise it will slowly solidify and cause waste. The mixed glue should be sealed and stored and used up within the safe operation period, otherwise it will slowly solidify and cause waste.
2. The following conditions can be used for curing: 25℃, 24 hours; 65℃, 1 hour; 100℃, 30 minutes; 120℃, 20 minutes; 150℃, 10 minutes. For larger devices, the curing time needs to be extended. .
3. Do not contact N, P, S ion compounds such as sulfur, polysulfide compounds, polysulfone or other sulfur-containing materials, amines, polyurethanes, amides and azides. It should not be in contact with ionic compounds of heavy metals such as Sn, Pb, Hg, Sb, Bi, As, and organic compounds containing unsaturated groups such as acetylene, otherwise it will cause poor curing of the glue. Therefore, the compatibility test of silicone rubber and substrate should be carried out before use. This problem can be avoided by cleaning the substrate with solvent or baking it at a temperature slightly higher than the curing temperature. Temperature and curing time: 25℃, 120min will not flow; 30min will fully cure at 120℃.
4. After curing and molding, it can still be easily removed, repaired or modified. The repaired area can be resealed with new gel. Since the gel has good compatibility with itself, the repaired area will become one with the original material.
Package
A / B Component 20KG
A / B Component 180KG
Storage and Shelf life
Belonging to non hazardous materials, please store in a cool and dry place with a temperature below 35 ℃, and the validity period is 12 months.
