Core Positioning
IOTA GNJ 3200PC two-component addition-cured thermal silicone gel features "2W·m⁻¹·K⁻¹ thermal conductivity + vertical non-flowing property", designed for efficient heat dissipation of power batteries, electronic devices and other heat-generating components. Cured to a soft, compressible state with electrical insulation and flame retardancy, it is an ideal material for solving precision electronic heat dissipation and rework challenges.

Product Features: Dual Optimization of Heat Dissipation and Process

• High-Efficiency Thermal Conductivity, Stable Heat Dissipation：Thermal conductivity of 2W·m⁻¹·K⁻¹ enables rapid heat transfer, reducing operating temperature of heat-generating components; forms uniform thermal interface after curing with thermal resistance as low as 0.8℃·in²/W (@50psi pressure), suitable for high heat flux scenarios like power battery cells, CPUs, and LED drivers.
• Vertical Non-Flowing, Precise Application：No flow in horizontal or vertical directions after application, accurately filling component gaps and avoiding uneven heat dissipation caused by flowing; medium viscosity paste (8000-12000mPa·s at 25℃) adapts to dispensing and coating processes with no bubble residue risk.
• Flexible Curing, Easy Rework：Supports room temperature curing (24h full cure) or heat-accelerated curing (80℃/2h) to meet different production rhythms; soft cured texture allows direct peeling, solving the problem of difficult disassembly and component damage with traditional thermal materials.
• Safe and Reliable, Comprehensive Performance：UL94 V-0 flame retardant rating, self-extinguishing; volume resistivity ＞10¹⁴Ω·cm, dielectric strength ＞25kV/mm, excellent insulation; curing shrinkage ＜0.5% to avoid structural stress on components.

Typical Applications

• Power Battery Field：After filling between cells, module cycle test (1000 times) temperature difference is controlled within ±2℃, reducing thermal runaway risk by 30% and improving battery pack safety.
• Consumer Electronics：Laptop CPU heat dissipation reduces core temperature by 12℃ after 2-hour operation, improving stability by 18% and avoiding performance throttling due to overheating.
• Industrial Electronics：Inverter power module potting reduces case temperature by 15℃ after 48-hour continuous operation, meeting IP65 dust/waterproof requirements for harsh working conditions.

Quality Assurance
RoHS 2.0 and UL certified, available in 50ml/300ml/20kg packaging with customizable viscosity and curing speed. Choose IOTA GNJ 3200PC to build a safe and reliable heat dissipation channel for heat-generating components with "high-efficiency thermal conductivity + easy rework" properties.