Core Value
IOTA GNJ 3125 one-component pre-cured thermal silicone gel features "ready-to-use + high adaptability", designed to provide efficient heat dissipation solutions for precision electronic components such as automotive electronics, communication devices, and network terminals. The no-mixing, no-curing features simplifies the construction process, while high adhesion and compressibility ensure perfect filling of complex gaps, making it an ideal material for improving heat dissipation efficiency and reliability of electronic devices.

Product Features: Dual Breakthroughs in Convenience and Performance

• One-Component Design, Zero Construction Threshold：No mixing or curing required, ready to use out of the box, eliminating the measuring and stirring steps of traditional two-component materials, increasing construction efficiency by 60%; compatible with automated and manual application to meet different production line needs.
• High Thermal Conductivity & Low Thermal Resistance, Excellent Heat Dissipation：Thermal conductivity ＞2.0W·m⁻¹·K⁻¹, thermal resistance as low as 0.5℃·in²/W (@50psi pressure), quickly transferring heat from chips and modules; medium thickness of 0.1~1mm enables efficient thermal management in lightweight designs.
• High Adhesion & Reworkable, Flexible Maintenance：Surface adhesion ＞5N/cm to prevent falling off after lamination; soft and stress-free (Shore 00 hardness 10-20), compressibility ＞40% to absorb component vibration and impact; supports direct peeling for rework, solving the problem of difficult disassembly and component damage with traditional thermal materials.
• No Settling or Flowing, Precise Gap Filling：Thixotropic paste design, no flowing in vertical or horizontal directions after application, accurately filling uneven gaps above 0.05mm; no silicone oil precipitation, non-corrosive to metals and plastics, ensuring long-term stable operation of electronic components.

Typical Applications

• Automotive Electronics：After laminating on-vehicle ECU modules, core temperature decreases by 12℃ after 48-hour continuous operation, meeting -40℃~125℃ wide temperature requirements and passing ISO 16750 vibration test standards.
• Communication Equipment：Heat dissipation for 5G base station PA modules, performance attenuation ＜5% after 1000 thermal cycles (-40℃~85℃), ensuring stable signal transmission.
• Consumer Electronics：Lamination between laptop CPU and heat sink improves heat dissipation efficiency by 25% compared to traditional thermal pads, reducing surface temperature by 8℃ after 2-hour operation and avoiding performance throttling due to overheating.

Quality Assurance
RoHS 2.0 certified, UL94 V-0 flame retardant, available in 0.5m×5m rolls, 50ml syringes and other packaging specifications. Choose IOTA GNJ 3125 to build a reliable thermal management barrier for electronic devices with "zero construction threshold + efficient heat dissipation" properties.