Thermal conductive silicon gel as a special thermal interface material is widely used in various fields, but at present, the high-end market of domestic thermal conductive silicon gel is basically occupied by foreign thermal interface material companies, and the technology of domestic thermal conductive silicon gel is uneven.

At present, thermal conductive silicon gel is limited to the blending of silicone matrix and common thermal conductive powder, and the comprehensive performance of the obtained thermal conductive silicon gel is poor, and it can not be applied to high-end fields. Therefore, it is necessary to improve the comprehensive performance of thermal conductive silicon gel from the aspects of silicone resin body, thermal conductive powder and the combination of body and thermal conductive powder, such as the type, molecular weight and distribution, viscosity and proportion of silicone matrix design, and the introduction of functional side chain and other methods to modify the matrix. The cross-linking degree optimization of the matrix by means of dendritic or large ring structure of hydrogen-containing siloxanes, surface functionalization of the thermal conductive fillers, and hybrid treatment of the fillers when the matrix and thermal conductive fillers are combined will become new directions in the research of thermal conductive silicon gels.

With the advent of the high-frequency and high-speed 5G era, the integration of electronic devices has improved, the number of networked devices has increased, and the number of antennas has increased, the power consumption of devices has increased, and the heat output has also risen rapidly. The new thermal conductive silicon gel with excellent comprehensive properties will also become one of the essential materials in strategic emerging fields and be widely used in various fields.


A single-component pre-cured thermally conductive silicone gel,pls check IOTA DZ125