With the breakthrough of semiconductor material technology, higher requirements are put forward for the voltage and frequency of power devices. Higher voltage and faster switching frequency result in a large amount of heat generated during the operation of the device, and heat as a by-product affects the insulation performance of the packaging material. Silicone gel material has become an indispensable packaging insulation material for electronic devices because of its excellent temperature resistance, water resistance and electrical insulation properties. At present, silicone-based IGBT module potting commonly used silicone gel is a two-component addition molding room temperature or temperature vulcanized silicone gel.



two-component 1:1 addition silicone gel,pls check IOTA 6450