Application characteristics

1, strong plasticity, can meet the uneven interface filling;

2, with high thermal conductivity, low compression force application;

3, high electrical insulation, good temperature resistance, automatic use and other performance;

4, soft and has better surface affinity, can be compressed to a very low thickness, so that the heat transfer efficiency is significantly improved;

5, thermal gel hardness is very low, even no hardness, after the use of the equipment will not produce internal stress;

6, can be directly weighed and used, can achieve fixed-point quantitative control;


Organic silicon thermal conductive gel,pls check IOTA DZ6200PC