IOTA GNJ 3125 is a one-component pre-cured thermal conductive silicone gel engineered for automotive electronics, communication devices, network terminals, and electronic modules. With "ready-to-use, high thermal conductivity, and stress-free" core advantages, it redefines standards for electronic thermal interface materials. Pre-cured at production, it requires no mixing or secondary curing, enabling immediate use out of the box—simplifying workflows,fit automated and manual applications, and boosting production efficiency.

Key performance highlights: 3.0W·m⁻¹·K⁻¹ thermal conductivity and 0.12℃·cm²/W thermal resistance ensure rapid heat transfer, solving local overheating in chips and PCBs; high surface adhesion (1.5N/cm peel strength) enables strong bonding to metals, ceramics, and plastics without additional adhesives, while easy reworkability allows residue-free removal for maintenance. Its soft, compressible texture (Shore 00 hardness 30±5) and 0.1~1mm thickness range adapt to uneven gaps, eliminating air pockets for "zero-contact thermal resistance" heat dissipation.

Applications include automotive electronics (radar, ECU module bonding), 5G base stations (optical module-radiator gap filling), network terminals (router/switch chip cooling), and consumer electronics (laptop CPU/GPU interfaces). Non-settling and non-flowing, it resists displacement from vibration or temperature changes, with -60~200℃ temperature resistance for extreme environments. RoHS-compliant, halogen-free, and VOC-free, it ensures long-term component reliability without corrosion.

User-friendly features: Available in rolls or sheets (standard 200mm×300mm, customizable), with die-cutting support for tailored shapes; 12-month shelf life at room temperature (no cold storage required), reducing logistics costs. Compared to two-component materials, it eliminates mixing errors,improving material utilization to >95%, and cuts production time by 40%.

IOTA GNJ 3125 integrates "pre-cured convenience + high thermal performance + stress-free bonding" to deliver an all-in-one solution for electronics manufacturing, ideal for automotive and communication sectors demanding efficiency and reliability. It empowers businesses to enhance heat dissipation, reduce costs, and gain market competitiveness.

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