The main applications of Silicone as a stable and reliable polymer material on IGBTs are potting (i.e., Silicone gel) and thermal conductivity (i.e., high thermal conductivity silicone grease between the coating module and the heat dissipation plate). Silicone gel is a kind of liquid and solid two phases of the "solid-liquid coexistence" of special silicone rubber, its texture is very soft, will not produce mechanical stress on the IGBT chip, even if the temperature between -50℃~200℃, its soft performance is basically unchanged, can well protect the IGBT chip from moisture erosion, To achieve insulation, moisture-proof, dust-proof, shock absorption and anti-corrosion role.

There are many kinds of silicone gels, which can be divided into addition molding and condensation in terms of reaction types. Condensed silicone gel has good adhesion and self-repair, but small molecules will be produced in the reaction process, the shrinkage rate is large, and it is easy to form bubbles, so it is not suitable for power semiconductor packaging with high potting requirements. The additive silicone gel is mainly composed of vinyl silicone oil (or propylene), hydrogen-containing silicone oil and precious metal catalyst, etc., the reaction process is the addition reaction of vinyl and active hydrogen, no by-product production, high purity of sulfide and no shrinkage, so the additive silicone gel is mainly used in IGBT packaging.


addition silicone gel,pls check IOTA 6450